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BTA416Y series B and C
16 A three-quadrant triacs insulated, high commutation, high temperature
Rev. 02 -- 11 March 2008 Product data sheet
1. Product profile
1.1 General description
Passivated, new generation, high commutation triacs in an internally insulated TO-220 plastic package.
1.2 Features
I Very high commutation performance I Isolated mounting base I High operating junction temperature I High immunity to dV/dt I 2500 V RMS isolation voltage
1.3 Applications
I Heating and cooking appliances I Non-linear rectifier-fed motor loads I High power motor control - e.g. vacuum I Electronic thermostats for heating and cleaners cooling loads I Solid state relays
1.4 Quick reference data
I VDRM 600 V (BTA416Y-600B/C) I VDRM 800 V (BTA416Y-800B/C) I ITSM 160 A (t = 20 ms) I IGT 50 mA (BTA416Y series B) I IGT 35 mA (BTA416Y series C) I IT(RMS) 16 A
NXP Semiconductors
BTA416Y series B and C
16 A 3-quadrant triacs insulated, high commutation, high temperature
2. Pinning information
Table 1. Pin 1 2 3 mb Pinning Description main terminal 1 (T1) main terminal 2 (T2) gate (G) mounting base; isolated
mb T2
sym051
Simplified outline
Graphic symbol
T1 G
123
SOT78D (TO-220)
3. Ordering information
Table 2. Ordering information Package Name BTA416Y-600B BTA416Y-600C BTA416Y-800B BTA416Y-800C TO-220 Description Version plastic single-ended package; isolated heatsink mounted; 1 mounting hole; SOT78D 3-lead TO-220 Type number
4. Limiting values
Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDRM IT(RMS) ITSM Parameter repetitive peak off-state voltage RMS on-state current non-repetitive peak on-state current Conditions BTA416Y-600B; BTA416Y-600C BTA416Y-800B; BTA416Y-800C full sine wave; Tmb 108 C; see Figure 4 and 5 full sine wave; Tj = 25 C prior to surge; see Figure 2 and 3 t = 20 ms t = 16.7 ms I2t dIT/dt IGM PGM I2t for fusing tp = 10 ms ITM = 20 A; IG = 0.2 A; dIG/dt = 0.2 A/s rate of rise of on-state current peak gate current peak gate power 160 176 128 100 4 5 A A A2s A/s A W
[1]
Min -
Max 600 800 16
Unit V V A
BTA416Y_SER_B_C_2
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 -- 11 March 2008
2 of 12
NXP Semiconductors
BTA416Y series B and C
16 A 3-quadrant triacs insulated, high commutation, high temperature
Table 3. Limiting values ...continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol PG(AV) Tstg Tj
[1]
Parameter average gate power storage temperature junction temperature
Conditions over any 20 ms period
Min -40 -
Max 1 +150 150
Unit W C C
Although not recommended, off-state voltages up to 800 V may be applied without damage, but the triac may switch to the on-state. The rate of rise of current should not exceed 15 A/s.
20 Ptot (W) 16
003aab816
conduction angle (degrees) 30 60 90 120 180
form factor a 4 2.8 2.2 1.9 1.57
= 180 120
90 60 30
12
8
4
0 0 2 4 6 8 10 12 14 16 I 18 T(RMS) (A)
= conduction angle
Fig 1.
Total power dissipation as a function of RMS on-state current; maximum values
003aab817
180 ITSM (A) 150
120
90
IT ITSM t
60
30
1/f Tj(init) = 25 C max
0 1 10
102
n (number of cycles)
103
f = 50 Hz
Fig 2.
Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values
BTA416Y_SER_B_C_2
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 -- 11 March 2008
3 of 12
NXP Semiconductors
BTA416Y series B and C
16 A 3-quadrant triacs insulated, high commutation, high temperature
103 ITSM (A)
003aab818
(1)
102
IT ITSM t tp Tj(init) = 25 C max
10 10-5
10-4
10-3
10-2
tp (s)
10-1
tp 20 ms (1) dIT/dt limit
Fig 3.
Non-repetitive peak on-state current as a function of pulse duration; maximum values
003aab819 003aab820
60 IT(RMS) (A) 50
20 IT(RMS) (A) 16
40 12 30 8 20 4
10
0 10-2
10-1
1 10 surge duration (s)
0 -50
0
50
100
150 Tmb (C)
f = 50 Hz; Tmb = 108 C
Fig 4.
RMS on-state current as a function of surge duration; maximum values
Fig 5.
RMS on-state current as a function of mounting base temperature; maximum values
BTA416Y_SER_B_C_2
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 -- 11 March 2008
4 of 12
NXP Semiconductors
BTA416Y series B and C
16 A 3-quadrant triacs insulated, high commutation, high temperature
5. Thermal characteristics
Table 4. Symbol Rth(j-mb) Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to mounting base thermal resistance from junction to ambient Conditions full cycle; see Figure 6 in free air Min Typ 60 Max 1.9 Unit K/W K/W
10 Zth(j-mb) (K/W) 1
003aab821
10-1
P
10-2
tp
t
10-3 10-5
10-4
10-3
10-2
10-1
1 tp (s)
10
Fig 6.
Transient thermal impedance from junction to mounting base as a function of pulse duration
6. Isolation characteristics
Table 5. Isolation limiting values and characteristics Th = 25 C unless otherwise specified. Symbol Visol(RMS) Parameter Conditions Min Typ Max 2500 Unit V RMS isolation voltage from all three terminals to external heatsink; f = 50 Hz to 60 Hz; sinusoidal waveform; RH 65 %; clean and dust free isolation capacitance from pin 2 to external heatsink; f = 1 MHz
Cisol
-
10
-
pF
BTA416Y_SER_B_C_2
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 -- 11 March 2008
5 of 12
NXP Semiconductors
BTA416Y series B and C
16 A 3-quadrant triacs insulated, high commutation, high temperature
7. Static characteristics
Table 6. Static characteristics Tj = 25 C unless otherwise specified. Symbol Parameter Conditions BTA416Y-600B BTA416Y-800B Min IGT gate trigger current VD = 12 V; IT = 0.1 A; see Figure 8 T2+ G+ T2+ G- T2- G- IL latching current VD = 12 V; IG = 0.1 A; see Figure 10 T2+ G+ T2+ G- T2- G- IH VT VGT ID holding current on-state voltage gate trigger voltage off-state current VD = 12 V; IG = 0.1 A; see Figure 11 IT = 20 A; see Figure 9 VD = 12 V; IT = 0.1 A; see Figure 7 VD = 400 V; IT = 0.1 A; Tj = 150 C VD = VDRM(max); Tj = 125 C VD = VDRM(max); Tj = 150 C 0.25 1.2 0.7 0.4 0.1 0.4 60 90 60 60 1.5 1.5 0.5 2 0.25 1.2 0.7 0.4 0.1 0.4 50 60 50 35 1.5 1.5 0.5 2 mA mA mA mA V V V mA mA 2 2 2 50 50 50 2 2 2 35 35 35 mA mA mA Typ Max BTA416Y-600C BTA416Y-800C Min Typ Max Unit
BTA416Y_SER_B_C_2
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 -- 11 March 2008
6 of 12
NXP Semiconductors
BTA416Y series B and C
16 A 3-quadrant triacs insulated, high commutation, high temperature
8. Dynamic characteristics
Table 7. Dynamic characteristics Conditions BTA416Y-600B BTA416Y-800B Min dVD/dt rate of rise of off-state voltage rate of change of commutating current gate-controlle d turn-on time VDM = 0.67 x VDRM(max); Tj = 125 C; exponential waveform; gate open circuit VDM = 0.67 x VDRM(max); Tj = 150 C; exponential waveform; gate open circuit VDM = 400 V; Tj = 125 C; IT(RMS) = 16 A; without snubber; gate open circuit VDM = 400 V; Tj = 150 C; IT(RMS) = 16 A; without snubber; gate open circuit ITM = 20 A; VD = VDRM(max); IG = 0.1 A; dIG/dt = 5 A/s 1000 600 15 6 Typ 2 Max BTA416Y-600C BTA416Y-800C Min 500 300 10 4 Typ 2 Max V/s V/s A/ms A/ms s Unit Symbol Parameter
dIcom/dt
tgt
1.6 VGT VGT(25C) 1.2
001aag168
3 IGT IGT(25C) 2
001aag165
(1)
(2)
(3)
0.8
1
0.4 -50
0
50
100
Tj (C)
150
0 -50
0
50
100
Tj (C)
150
(1) T2- G- (2) T2+ G- (3) T2+ G+
Fig 7.
Normalized gate trigger voltage as a function of junction temperature
Fig 8.
Normalized gate trigger current as a function of junction temperature
BTA416Y_SER_B_C_2
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 -- 11 March 2008
7 of 12
NXP Semiconductors
BTA416Y series B and C
16 A 3-quadrant triacs insulated, high commutation, high temperature
50 IT (A) 40
003aab822
3 IL IL(25C) 2
001aag166
30
20
(1)
(2)
(3)
1
10
0 0 0.5 1 1.5 VT (V) 2
0 -50
0
50
100 Tj (C)
150
Vo = 1.086 V Rs = 0.017 (1) Tj = 150 C; typical values (2) Tj = 150 C; maximum values (3) Tj = 25 C; maximum values
Fig 9.
On-state current as a function of on-state voltage
3 IH IH(25C) 2
Fig 10. Normalized latching current as a function of junction temperature
001aag167
1
0 -50
0
50
100
Tj (C)
150
Fig 11. Normalized holding current as a function of junction temperature
BTA416Y_SER_B_C_2
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 -- 11 March 2008
8 of 12
NXP Semiconductors
BTA416Y series B and C
16 A 3-quadrant triacs insulated, high commutation, high temperature
9. Package outline
Plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3-lead TO-220 SOT78D
E p mounting base
A A1 q
D1
D
L1
Q
b2 L b1
1
2
3
w b e e
M
c
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 4.7 4.3 A1 1.40 1.25 b 0.9 0.6 b1 1.4 1.1 b2 1.72 1.32 c 0.6 0.4 D 16.0 15.2 D1 ref 6.5 E 10.3 9.7 e 2.54 L 14.0 12.8 L1 ref 3.0 p 3.7 3.5 Q 2.6 2.2 q 3.0 2.7 w 0.2
OUTLINE VERSION SOT78D
REFERENCES IEC JEDEC TO-220 JEITA
EUROPEAN PROJECTION
ISSUE DATE 07-04-04 07-07-10
Fig 12. Package outline SOT78D (TO-220)
BTA416Y_SER_B_C_2 (c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 -- 11 March 2008
9 of 12
NXP Semiconductors
BTA416Y series B and C
16 A 3-quadrant triacs insulated, high commutation, high temperature
10. Revision history
Table 8. Revision history Release date 20080311 Data sheet status Product data sheet Change notice Supersedes BTA416Y_SER_B_C_1 Document ID BTA416Y_SER_B_C_2 Modifications: BTA416Y_SER_B_C_1
* *
Table 3 "Limiting values" uprated values for IGM and PG(AV) Table 3 "Limiting values" updated I2t condition symbol Product data sheet -
20071003
BTA416Y_SER_B_C_2
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 -- 11 March 2008
10 of 12
NXP Semiconductors
BTA416Y series B and C
16 A 3-quadrant triacs insulated, high commutation, high temperature
11. Legal information
11.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
11.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
11.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
BTA416Y_SER_B_C_2
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 -- 11 March 2008
11 of 12
NXP Semiconductors
BTA416Y series B and C
16 A 3-quadrant triacs insulated, high commutation, high temperature
13. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5 Isolation characteristics . . . . . . . . . . . . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 11 March 2008 Document identifier: BTA416Y_SER_B_C_2

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